SCC-150 端面切断研削装置  End-face cutting / grinding machine

◆特長 Features

●ワーク形状及び加工仕様によっては、切断(粗)をOD-SAW で行う事が可能

  •   It detects the sapphire ingot’s C-axis and grinds the C-face.
  •   Depending on the shape of the work piece or the specifications of processing, it is available to cut (roughly) with O. D. saw.
  •   Its mounting of X-Ray units makes it possible to automatize the sequence of processes from cutting to finishing.

Please contact us for the details of this machine.


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